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1. general description the UBA2213 family of integrated circuits are a range of high voltage monolithic ics for driving compact fluorescent lamps (cfl) in half-bridge configurations. the family is designed to provide easy integration of lamp loads across a range of burner power and mains voltages. 2. features and benefits 2.1 system integration ? integrated half-bridge power transistors ? UBA2213a: 220 v; 13.5 ? ; 0.9 a maximum ignition current ? UBA2213b: 220 v; 9 ? ; 1.35 a maximum ignition current ? UBA2213c: 220 v; 6.6 ? ; 1.85 a maximum ignition current ? integrated bootstrap diode ? integrated high-voltage supply 2.2 general ? adjustable current controlled preheat mode enables the preheat time (t ph ) to be set ? glow-time control minimizes electrode damage in non-preheat applications ? rms current control 2.3 fast and smoo th light out ? boost with externally controlled timing ? temperature controlled timi ng during boost state ? smooth transition from boost to burn state 2.4 burner lifetime ? current controlled preheat with adjustable preheat time ? minimum glow time control to support cold start ? lamp power independent from mains voltage variations ? lamp inductor saturation protection during ignition UBA2213 half-bridge power ic family for cfl lamps rev. 2 ? 21 november 2011 product data sheet
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 2 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 2.5 safety ? overtemperature protection (otp) ? capacitive mode protection (cmp) ? saturation current protection (scp) ? overpower control ? system shutdown at burner end of life 2.6 ease of use ? adjustable operating frequency for easy fit with various burners ? each device in the family incorporates th e same controller functionality ensuring easy power scaling and roll-out across a complete range of cfls 3. applications ? compact fluorescent lamps up to 23 w for indoor and outdoor applications 4. ordering information table 1. ordering information type number package name description version UBA2213ap/n1 dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 UBA2213bp/n1 UBA2213cp/n1 UBA2213at/n1 so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 UBA2213bt/n1 UBA2213ct/n1
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 3 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 5. block diagram in the so14 package, the two diodes which are required for the dvdt supply are integrated and connected between pins dvdt and pgnd. mount these diodes externally when using the dip8 packaged devices because the are not bonded. UBA2213xt (so14) pin numbers are between brackets. n.p. in the diagram means not present in UBA2213xp (dip8 package). fig 1. block diagram 001aan138 c osc c bs c lamp c vdd c out1 l lamp r osc c sw c out2 v o(ref)rms otp i sat reset startup UBA2213 f osc reset v dd v dd v dd v dd 7(6) dvdt n.p. (5) hv 6(3) rectified mains n.p. (4) v dd latch hspt driver hspt fs sense out 3(11) 4(12) 5(14) rc sw 8(7) 1(8) glow and i sat control pulse voltage controlled oscillator v sw :2 v sw(ph) rms control burn state v o(ref)rms non-overlap timer lspt driver x 2 - v o(ref)rms 2 lamp hs on set boost preheat preheat/boost v ref(ph) v ref(boost) ls on sgnd 2(1, 2, 9, 10, 13) lspt c dvdt sgnd r sense
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 4 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration for UBA2213xp (sot97-1) fi g 3. pin configuration for UBA2213xt (sot108-1) UBA2213p sw rc sgnd v dd fs hv sense out 001aan203 1 2 3 4 6 5 8 7 UBA2213t sgnd out sgnd sgnd hv sense pgnd fs dvdt sgnd v dd sgnd rc sw 001aan201 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 2. pin description symbol pin description UBA2213xp UBA2213xt sw 1 8 sweep timing and vco input sgnd 2 1, 2, 9, 10, 13 signal ground fs 3 11 high-side floating supply output sense 4 12 voltage sense for preheat and rms control out 5 14 half-bridge output hv 6 3 high-voltage supply v dd 7 6 internal low-voltage supply output rc 8 7 internal oscillator input dvdt n.p. 5 dvdt supply input pgnd n.p. 4 dvdt supply ground
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 5 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 7. functional description 7.1 supply voltage the UBA2213 family is powered using a start-up current source and a dvdt supply. when the voltage on pin hv increases, the v dd capacitor (c vdd ) is charged using the internal jfet current source. the voltage on pin v dd rises until v dd equals v dd(start) . the start-up current source is then disabled. the half-bridge starts switching causing the charge pump to generate the required v dd supply. the amount of current flowing towards v dd equals v i(hv) ? c dvdt ? f where f represents the momentary frequency. the charge pump consists of an external half-bridge capacitor (c dvdt ). the so14 package contains two internal diodes with an internal zener diode. mount these diodes externally with dip8 pack aged devices. the zener diode ensures the v dd voltage cannot rise above the maximum v dd rating. the dvdt supply has its own ground pin (pgnd) to prevent large peak currents from flowing through the external small signal ground pin (sgnd). the start-up current source is enabled when the voltage on pin v dd is below the v dd(stop) level. 7.2 start-up state when the supply voltage on pin v dd increases, the ic enters the start-up state. in the start-up state, the high-side power transi stor (hspt) is switched off and the low-side power transistor (lspt) is switched on. the circuit is reset and the capacitors on the bootstrap pin fs (c bs ) and the low-voltage supply pin v dd (c vdd ) are charged. pins rc and sw are switched to ground. when pin v dd is above v dd(start) , the start-up state is exited and the preheat state is entered. if the voltage on pin v dd falls below v dd(stop) , the system return s to the start-up state. remark: if otp is active, the ic remains in the start-up state indefinitely. the v dd voltage slowly oscillates between v dd =v dd(stop) and v dd =v dd(start) . 7.3 reset a dc reset circuit is incorporated in the hi gh-side driver. the high-side transistor is switched off when the voltage on pin fs is below the high-side lockout voltage. 7.4 oscillation control the oscillation frequency is based on the 555- timer function. a self oscillating circuit is created comprising the exter nal components: resistors r osc , r sense and capacitor c osc . r osc and c osc define the nominal oscillating frequency. an internal divider 0.5 ? f osc(int) is used to generate the accurate 50 % duty cycle. the divider sets the bridge frequency at half the oscillator frequency. the input on pin sw generates the signal v sw and it is used to determine the frequency in all states except preheat and boost. signal v sw(ph) is an internally generated signal used to determine the frequency during the preheat state.
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 6 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps the output voltage of the bridge changes with the falling edge of the signal on pin rc. the nominal half-bridge frequency is shown in equation 1 : (1) the maximum frequency is 2.5 ? f osc(nom) and is set at v sw . an overview of the oscillator, internal lspt and hspt drive signals and the output is shown in figure 4 . 7.5 preheat state as described in section 7.2 , the ic enters the preheat state when the voltage on pin v dd is above v dd(start) and otp is not active. the sweep current (i sw ) charges the capacitor on pin sw (c sw ). the preheat operational tran sconductance amplifier (ota) is enabled and the half-bridge circuit starts oscillating. the preheat current is moni tored using the external r sense resistor. the ota controls the frequency using output voltage v sw(ph) so that the peak voltage across r sense equals the internal reference voltage (v ref(ph) ). the peak voltage is the vo ltage at the end of the lspt conduction time. the preheat peak current th rough the lamp filament is calculated as shown in equation 2 : (2) the external capacitor (c sw ) defines the preheat time. typica lly, the external capacitor is calculated as shown in equation 3 .the preheat state ends when the down-going c sw voltage equals v sw(ph) ; see figure 4 . fig 4. oscillator, hspt/lspt drivers and output signals f osc nom ?? 1 k osc r osc ? c osc ? ------------------------------------------- = time (s) v rc v out 0 hspt driver lspt driver half-bridge time (s) time (s) time (s) 001aam035 0 0 0 i ph peak ?? v ref ph ?? r sense ----------------- - =
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 7 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps (3) if during the preheat time, capacitive mode is sensed, the internal v sw(ph) node is discharged. the frequency sweep increases unt il the system is set to the operating point where capacitive mode switching is minimized. 7.6 ignition state the ignition state is entered after the preheat state has finished. the capacitor on pin sw (c sw ) is charged by i sw up to 0.6 ? v h(rc) which corresponds to the frequency f osc(nom) . during this frequency sweep, the resonance fr equency is reached resulting in the ignition of the lamp (see figure 4 ). the lamp inductor (l lamp ) and lamp capacitor (c lamp ) set resonance frequency. the ignition state ends when the voltage on pin sw (v sw ) reaches 0.6 ? v h(rc) . 7.7 boost state and tran sition to steady state the boost state is entered after ignition. duri ng boost period, vco?s input is connected to an internal voltage to get the fix frequency f min . the UBA2213 can provide a higher current than steady state, the current ratio can be set by external component. capacitor c sw is charged and discharged using an internal current generated saw-tooth waveform which sets boost time. fig 5. v lamp , f osc(int) , v sw , and v sw(ph) plotted against time c sw t ph 1.5 s 100 nf ? ------------------------------------ = rms f osc(int) 2.5 f osc(nom) f osc(nom) f osc(boost) v sw high v sw boosth v swinter boost 0.6 v h(rc) v sw boostl v sw v lamp 001aan139 preheat boost transition ignition ... ... v sw(ph)
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 8 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps when boost state is ended, transition control is turned on. v ph is disconnected to v sw and reset. capacitor c sw is discharged by internal current, the frequency was increased from f min to f nom . the transition state ends when the voltage on pin sw (v sw ) reaches 0.6 ? v h(rc) . 7.8 steady state in the steady state, the rms current control is active. this control sets the frequency so that the rms voltage acro ss the sense resistor (r sense ) is equal to v o(ref)rms . this feature ensures the current through the power switches and through the lamp is constant. this results in constant ic dissipation and temperature at a fixed ambient temperature. during one oscillator clock cycl e, the voltage on pin sense (v sense ) is squared and converted into a positive current. this discharge current is added to the capacitor c sw . during the other oscillator clock cycle, the input of the squarer is conn ected to the internal reference voltage v o(ref)rms . this voltage is squared and converted into a negative current. this charge current is also added to capacitor c sw . when both currents are equal, then equation 4 is true: (4) where t osc equals the operating frequency f osc /1. taking the square root of both sides results in equation 5 : (5) or (6) the internal reference voltage (v o(ref)rms ) and the external r sense resistor define the constant current which flows through the power switches and the lamp. 7.9 non-overlap time the non-overlap time is defined as the time when both mosfets are not conducting. the non-overlap time is fixed internally and is fixed at the t no value (see ta b l e 5 ). 7.10 overtemperature protection (otp) otp is active in all states except boost. when the die temperature reaches the otp activation threshold (t th(act)otp ), the oscillator is stopp ed and the power switches (lspt/hspt) are set to the start-up state. when the oscillator is stopped, the dvdt supply no longer generates the supply current i dvdt . voltage v dd gradually decreases and the start-up state is entered as described in section 7.2 on page 5 . otp is reset when the temperature < t th(rel)otp . 1 t osc --------- - v sense 2 t ?? dt 1 t osc --------- - v oref ?? rms 2 dt 0 t osc ? ? = 0 t osc ? ? 1 t osc --------- - v sense 2 t ?? dt 0 t osc ? ? 1 t osc --------- - v oref ?? rms 2 dt 0 t osc ? ? = rms v sense v oref ?? rms r sense i lspt ? ==
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 9 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps during boost state, the threshold of temperature is t j(end)bst which is lower than t th(otp) . when the die temperature has reached t j(end)bst , the boost state ends, the ic enters steady state and otp is enabled. 7.11 minimum glow time control if the preheat time is set too sh ort or omitted, the lamp electrodes do not have the correct temperature in the ignition state. this resu lts in instant light but also in a reduced switching lifetime because when the electrode temperature is too low electrode sputtering and damage occur. the minimum glow time control limits electrode damage by ensuring maximum power use during the glow phase to heat the electrodes quickly (see figure 6 ). remark: the glow time control is active as t ph is too short to preheat the electrodes. 7.12 saturation current protection (scp) a critical parameter in the design of the lamp inductor is its saturation current. when the momentary inductor exceeds its saturation current, th e inductance drops significantly. if the inductance drops significantly, the inductor current and the current flowing through the lspt and hspt power switches increases rapi dly. this action can cause the current to exceed the half-bridge power transistors maximum ratings. saturation of the lamp inductor is likely to occur in cost-effective and miniaturized cfls. the UBA2213 family internally monitors the power transistor current. when this current exceeds the momentary rating of the internal power transistors, the conduction time is reduced and the frequency is slowly increased (by discharging c sw ). this function causes the system to balance at the edge of the current rating of the power switches. fig 6. v lamp , f osc(int) , v sw , and v sw(ph) plotted against time rms f osc(int) 2.5 f osc(nom) f osc(nom) f osc(boost) v sw high v sw boosth v swinter boost 0.6 v h(rc) v sw boostl v sw v lamp 001aan140 preheat boost glow transition ignition ... ... v sw(ph)
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 10 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 7.13 capacitive mode protection (cmp) when capacitive mode is detected, capacitor c sw is discharged causing the frequency to increase. the system sets itself to the operating point where capacitive mode switching is minimized. cmp is active during the ignition state and in the steady state. if capacitive mode is sens ed during preheat and boost st ate, the oscillator frequency increases step-by-step by discharging the inte rnal capacitor. this action continues until the system is set to the operat ing point where capacitive mode switching is minimized. cmp can be triggered for example, by an en d of a lamp life cond ition when a lamp electrode is broken. 8. limiting values [1] x where the last letter is p or t. [2] in accordance with the human body model (hbm): equi valent to discharging a 100 pf capacitor through a 1.5 k ? series resistor. [3] in accordance with the machine model (mm): equivalent to discharging a 200 pf capacitor through a 1.5 k ? series resistor and a 0.75 ? h inductor. table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v hv voltage on pin hv operating - 373 v mains transients: 10 minutes maximum over lifetime -550v v fs voltage on pin fs with respect to pin out 0 14 v v dd supply voltage dc supply 0 15 v v sense voltage on pin sense ? 5+5 v v rc voltage on pin rc i rc <1ma 0 v dd v v sw voltage on pin sw i sw <1ma 0 v dd v i out current on pin out t j <125 ?c [1] UBA2213ax ? 0.9 +0.9 a UBA2213bx ? 1.35 +1.35 a UBA2213cx ? 1.65 +1.65 a i dvdt current on pin dvdt t j <125 ?c ? 0.9 +0.9 a sr slew rate repetitive output on pin out ? 4+4 v/ns t j junction temperature ? 40 +150 ? c t stg storage temperature ? 55 +150 ? c v esd electrostatic discharge voltage hbm: [2] pins hv, fs, out - 1 kv pins sw, rc, vdd, dvdt - 2.5 kv mm: [3] all pins - 200 v cdm: [3] all pins - 500 v
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 11 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 9. thermal characteristics [1] in accordance with iec 60747-1 10. characteristics table 4. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air [1] 95 k/w r th(j-c) thermal resistance from junc tion to case in free air [1] 16 k/w table 5. characteristics t j = 25 ? c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit low-voltage supply start-up state i i(hv) input current on pin hv v i(hv) = 100 v - 0.85 - ma v dd(start) start supply voltage oscillation start 10.7 11.7 12.7 v v dd(stop) stop supply voltage oscillation stop 8 8.5 9 v v dd(hys) hysteresis of supply voltage start ? stop 3 3.5 4 v v dd(reg) regulation supply voltage - 13.8 - v i sink sink current capability of vdd regulator 6 - - ma output stage r on on-state resistance high-side transistor: [1] UBA2213ax; v i(hv) =310v; i d = 100 ma -13.5- ? UBA2213bx; v i(hv) =310v; i d = 100 ma -9.3- ? UBA2213cx; v i(hv) =310v; i d = 100 ma -6.6- ? low-side transistor: [1] UBA2213ax; i d = 100 ma - 13.5 - ? UBA2213bx; i d = 100 ma - 8.2 - ? UBA2213cx; i d =100ma - 6.6 - ? r on(150) /r on(25) on-state resistance ratio (150 ? cto 25 ?c) -1.4- v f forward voltage hs; i f = 200 ma - - 2.0 v ls; i f = 200 ma - - 2.0 v bootstrap diode; i f = 1 ma 0.7 1.0 1.3 v t no non-overlap time 1.05 1.35 1.65 ? s v i(fs) input voltage on pin fs undervoltage lockout with respect to pin out 3.6 4.2 4.8 v i i(fs) input current on pin fs v i(hv) =310v; v i(fs) = 12 v 10 14 18 ? a
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 12 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps i sat saturation current high-side transistor: [1] UBA2213ax; v ds =30v; t j ? 125 ? c; v i(hv) =310v 0.90 - - a UBA2213bx; v ds =30v; t j ? 125 ? c; v i(hv) =310v 1.35 - - a UBA2213cx; v ds =30v; t j ? 125 ?c; v i(hv) =310v 1.85 - - a low-side transistor: [1] UBA2213ax; v ds =30v; t j ? 125 ? c0.90--a UBA2213bx; v ds =30v; t j ? 125 ? c1.35--a UBA2213cx; v ds =30v; t j ? 125 ? c1.85--a internal oscillator f osc(int) internal oscillator frequency v sw = v dd ; steady state - - 60 khz f osc(nom) nominal oscillator frequency r osc = 100 k ? ; c osc = 220 pf; v sw =v dd 40.05 41.32 42.68 khz ? f osc(nom) / ? t nominal oscillator frequency variation with temperature r osc = 100 k ? ; c osc = 220 pf; ? t=? 20 to +150 ?c -2-% k h high-level trip point factor 0.371 0.384 0.397 k l low-level trip point factor 0.028 0.032 0.036 v h(rc) high-level voltage on pin rc trip point; v h(rc) =k h ? v dd 4.08 4.22 4.37 v v l(rc) low-level voltage on pin rc trip point; v l(rc) =k l ? v dd 0.308 0.352 0.396 v k osc oscillator constant r osc = 100 k ? ; c osc = 220 pf 1.065 1.1 1.135 preheat function v ref(ph) preheat reference voltage - 620 - mv t ph preheat time c sw =100nf - 1.2 - s c sw =68nf - 0.8 - s boost function f bst boost frequency r osc = 100 k ? ; c osc = 220 pf; v sw =vdd - 26 - khz t j(end)bst boost end junction temperature -85- ?c t bst boost time c sw =68nf - 51 - s t t transition time c sw =68nf - 0.7 - s rms current control function v o(ref)rms rms reference output voltage 262 285 308 mv table 5. characteristics ?continued t j = 25 ? c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 13 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps [1] x where the last letter is p or t. otp function t th(act)otp overtemperature protection activation threshold temperature 155 175 - ?c t th(rel)otp overtemperature protection release threshold temperature -100- ?c table 5. characteristics ?continued t j = 25 ? c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 14 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 11. application information the components used in figure 7 are illustrated in ta b l e 6 . remark: the customized component values depend on the burner characteristics. an on-line tool is available to calculate the requ ired components values. this on-line tool can be found on the product information page of the UBA2213. fig 7. application diagram for the so14 devices aaa-001490 r fuse d3 c buf c out1 c lamp l lamp c out2 c dvdt c osc c vdd r osc c sw c fs r sense l filt d2 d4 d1 u1 sgnd 114 out sgnd 21 3 sgnd hv 31 2 sense pgnd 41 1 fs dvdt 51 0 sgnd v dd 69 sgnd rc 78 sw lamp a c input l_n l_l UBA2213 table 6. so14 device bill of materials number reference alias typical value quantity 1r fuse 10 ? ; 1 w 1 2 d1, d2, d4, d5 m7 4 3c buf c1 2.7 ? f; 400 v; 105 ? c; 10*16 1 4c fs c5 10 nf; 50 v; 0805 1 5c sw , c vdd c6 100 nf; 50 v; 0805 2 6c dvdt c9 220 pf; 500 v 1 7c osc c7 220 pf; 50 v; 0805 1 9c0, c out1, c out2 c0, c2, c3 100 nf; 400 v; cl21 3 10 c lamp c4 2.2 nf; 1 kv; cbb28 1 11 l filt l1 3 mh; lgb 1 12 l lamp l2 3 mh; ee13; pc40 1 13 r osc r1 100 k ? ; 1 %; 0805 1 14 r sense r2 1.8 ? ; 1 w; 1 % 1 15 pcb UBA2213-1; UBA2213-8 2 16 ic UBA2213b 1 17 burner 3u-12 w; 2700k 1
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 15 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps the components used in figure 8 are illustrated in ta b l e 7 . remark: the customized component values depend on the burner characteristics. an on-line tool is available to calculate the requ ired components values. this on-line tool can be found on the product information page of the UBA2213. fig 8. application diagram for dip8 devices aaa-001491 r fuse d4 c buf c out1 c lamp l lamp c out2 c dvdt c fs r sense c sw r sw c vdd c osc r osc l filt d2 d3 d5b d5a d1 u1 fs 38 rc sw 7 vdd 1 sense 4 5 2 sgnd lamp UBA2213 hv 6 ac input l_l l_n table 7. dip8 device bill of materials number reference alias typical value quantity 1r fuse -2 2 ? ; 1 w 1 2 d1, d2, d4, d5 - m7 4 2 d5a, d5b - 1n4148 2 3c buf c1 2.7 ? f; 400 v; 105 ? c; 10*16 1 4c fs c5 10 nf; 50 v; 0805 1 5c sw , c vdd c6 100 nf; 50 v; 0805 2 6c dvdt c9 220 pf; 630 v 1 7c osc c7 220 pf; 50 v; 0805 1 9c out1, c out2 c0, c2, c3 100 nf; 400 v; cl21 3 10 c lamp c4 2.2 nf; 1 kv; cbb28 1 11 l filt l1 3 mh; lgb 1 12 l lamp l2 3 mh; ee13; pc40 1 13 r osc r1 100 k ? ; 1 %; 0805 1 14 r sense r2 1.8 ? ; 1 w; 1 % 1 15 r sw r sw not mounted 2 16 ic - UBA2213bp 1 17 burner - 3u-12 w; 2700k 1
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 16 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 12. package outline fig 9. package outline sot97-1 (dip8) references outline version european projection issue date iec jedec jeita sot97-1 99-12-27 03-02-13 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.045 0.17 0.02 0.13 b 2 050g01 mo-001 sc-504-8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 8 1 5 4 b e 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index dip8: plastic dual in-line package; 8 leads (300 mil) sot97-1
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 17 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps fig 10. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 18 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 13. revision history table 8. revision history document id release date data sheet status change notice supersedes UBA2213 v.2 20111121 product data sheet - UBA2213 v.1 UBA2213 v.1 20101202 objective data sheet - -
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 19 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 14.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
UBA2213 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 21 november 2011 20 of 21 nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 14.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors UBA2213 half-bridge power ic family for cfl lamps ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 21 november 2011 document identifier: UBA2213 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 system integration . . . . . . . . . . . . . . . . . . . . . . 1 2.2 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.3 fast and smooth light out . . . . . . . . . . . . . . . . . 1 2.4 burner lifetime . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.5 safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.6 ease of use. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 oscillation control . . . . . . . . . . . . . . . . . . . . . . . 5 7.5 preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.6 ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.7 boost state and transition to steady state. . . . . 7 7.8 steady state . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.9 non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 8 7.10 overtemperature protection (otp) . . . . . . . . . 8 7.11 minimum glow time control . . . . . . . . . . . . . . . . 9 7.12 saturation current protec tion (scp) . . . . . . . . 9 7.13 capacitive mode protection (cmp) . . . . . . . . 10 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 9 thermal characteristics . . . . . . . . . . . . . . . . . 11 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 application information. . . . . . . . . . . . . . . . . . 14 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 19 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 14.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15 contact information. . . . . . . . . . . . . . . . . . . . . 20 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

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